KEYFACTS

Reducing Costs and Complexity

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Reduce BOM

Leverage NPU, CPU and GPU to run demanding edge AI workloads without separate accelerator cards.

 

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Reach market faster

Use validated, application-ready COM platforms to cut design efforts and testing work.

 

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Simplify technology upgrades

Standardized modules enable technology refresh with only minimum adaptions.

 

 

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Enable new AI application classes

Deploy LLMs, sensor fusion, SLAM, and agentic AI at the edge without cloud connectivity.

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High scalability

Learn about the different form factors to match your exact SWaP-C envelope.

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Design for rugged environments

COMs offer different ruggedization levels for in-vehicle, railway, and outdoor deployments.

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CONTENT

Why you should read the whitepaper

  1. Learn about Intel’s 18A process technology with RibbonFET and PowerVia increase efficiency.

  2. Discover how integrated GPU compute removes the need for discrete AI accelerator cards.

  3. Understand which form factors suit new designs, and which suit legacy system upgrades.

  4. Explore how application-ready software building blocks reduce design complexity.

 
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Download the whitepaper

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This is how you get your personal copy of the whitepaper:

1. Fill out the form and click on "Get Whitepaper".
2. Check your email and confirm your email address.
3. You will receive an email from us with the link to the whitepaper.